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VDD 数据表(PDF) 8 Page - Pericom Semiconductor Corporation

部件名 VDD
功能描述  Low Power Spread Spectrum Frequency Multiplier SSCG-GP Family
PDF  9 Pages
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制造商  PERICOM [Pericom Semiconductor Corporation]
网页  http://www.pericom.com
标志 PERICOM - Pericom Semiconductor Corporation

VDD 数据表(HTML) 8 Page - Pericom Semiconductor Corporation

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8
PI6C3622-1
Low Power Spread Spectrum Frequency Multiplier
SSCG-GP Family
PS8944A
01/30/08
PCB Layout Recommendation
To optimize device performance, all components should be placed on the same side of the board and, therefore,
no vias are used through other signal layers. The part should be kept away from other signal traces including
ones just underneath the part or on layers adjacent to the ground plane layer used by the part. The PCB trace
from the part to the ground via should be kept as short as possible.
Packaging Mechanical: 8-pin, TSSOP
Physical Dimensions
Ordering Information
Ordering Code
Package Code
Package Description
PI6C3622-1LE
L
Pb-Free & Green, 8-Pin TSSOP
Notes:
1. Thermal characteristics and package top marking information can be found on the company web site at www.pericom.com/packaging/
2. E = Pb-free and Green Package
3. Adding an X suffix = Tape/Reel
DESCRIPTION: 8-Pin, 173-Mil Wide, TSSOP
PACKAGE CODE: L
DOCUMENT CONTROL NO.
PD - 1308
REVISION: E
DATE: 11/15/05
Note:
1.
Package Outline Exclusive of Mold Flash and Metal Burr
2.
Controlling dimentions in millimeters
3.
Ref: JEDEC MO-153F/AA
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com



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