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LP38513 数据表(PDF) 13 Page - Texas Instruments |
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LP38513 数据表(HTML) 13 Page - Texas Instruments |
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13 / 20 page ![]() LP38513 www.ti.com SNVS361C – JULY 2007 – REVISED MARCH 2009 As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. Figure 26 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C. Figure 26. Maximum Power Dissipation vs Ambient Temperature for the DDPAK/TO-263 Package Copyright © 2007–2009, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: LP38513 |
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