80960KB datasheet(27/44 Pages) INTEL

27 / 44 page

80960KB

3.0

MECHANICAL DATA

3.1

Packaging

The 80960KB is available in two package types:

• 132-lead ceramic pin-grid array (PGA). Pins are

arranged 0.100 inch (2.54 mm) center-to-center, in

a 14 by 14 matrix, three rows around (see Figure

17).

• 132-lead plastic quad flat pack (PQFP). This

package uses fine-pitch gull wing leads arranged

in a single row along the package perimeter with

0.025 inch (0.64 mm) spacing (see Figure 20).

Dimensions for both package types are given in the

Intel

Packaging handbook (Order #240800).

3.1.1

Pin Assignment

The PGA and PQFP have different pin assignments.

Figure 18 shows the view from the PGA bottom (pins

facing up) and Figure 19 shows a view from the PGA

top (pins facing down). Figure 20 shows the PQFP

package; Figure 21 shows the PQFP pinout with

signal names. Notice that the pins are numbered in

order from 1 to 132 around the package perimeter.

Table 10 and Table 11 list the function of each PGA

pin; Table 12 and Table 13 list the function of each

PQFP pin.

Figure 17. 132-Lead Pin-Grid Array (PGA) Package

BCD

F G

L M

80960KB 数据表(PDF) 27 Page - Intel Corporation