Pad Assignment

Chip size: 164

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit: mil

Pad No.

X

Y

Pad No.

X

Y

Pad No.

X

Y

1

–76.23

76.23

19

–16.61

–76.23

37

75.78

42.66

2

–76.23

68.13

20

–8.10

–76.23

38

75.78

61.56

3

–76.23

60.03

21

0.5

–76.23

39

61.20

76.23

4

–76.23

51.93

22

9.10

–76.23

40

52.56

76.23

5

–76.23

43.83

23

17.60

–76.23

41

43.65

76.23

6

–76.23

35.73

24

26.15

–76.23

42

35.10

76.23

7

–76.23

–27.63

25

34.70

–76.23

43

25.20

76.23

8

–76.23

–35.73

26

43.25

–76.23

44

15.71

76.23

9

–76.23

–43.83

27

51.89

–76.23

45

6.66

76.23

10

–76.23

–51.93

28

75.78

–76.23

46

–3.06

76.23

11

–76.23

–60.03

29

75.78

–67.14

47

–12.83

76.23

12

–76.23

–68.13

30

75.78

–56.34

48

–21.60

76.23

13

–76.23

–76.23

31

75.78

–46.62

49

–32.04

76.23

14

–66.33

–76.23

32

75.78

–35.64

50

–42.48

76.23

15

–50.81

–76.23

33

75.78

–24.75

51

–52.92

76.23

16

–42.26

–76.23

34

75.78

–13.32

52

–62.15

76.23

17

–33.71

–76.23

35

75.78

6.03

18

–25.16

–76.23

36

75.78

33.66

HT1602

2

28th Aug ’98