8

PS8601, PS8601L

SOLDERING PRECAUTION

(1) Infrared reflow soldering

• Peak temperature : 235

C or lower (plastic surface)

• Time

: 30 s or less

(Time during plastic surface temperature overs 210

C)

• No. of reflow times : Three

• Flux

: Rosin-base flux

INFRARED RAY REFLOW TEMPERATURE PROFILE

235 ˚C MAX

210 ˚C

to 30 s

60 to 90 s

(PRE-HEAT)

TIME (s)

120 to 160 ˚C

(ACTUAL HEAT)

to 10 s

<NOTES>

(1) Please avoid be removed the residual flux by water after the first reflow processes.

Peak Temperature 235 ˚C or lower

(2) Dip soldering

• Peak temperature : 260

C or lower

• Time

: 10 s or less

• Flux

: Rosin-base flux