AD7891_15 datasheet(3/20 Pages) AD

3 / 20 page

–3–

REV. D

AD7891

Parameter

A Version

B Version

Y Version

Unit

Test Conditions/Comments

LOGIC OUTPUTS

Output High Voltage, VOH

4.0

V min

ISOURCE = 200

mA.

Output Low Voltage, VOL

0.4

V max

ISINK = 1.6 mA.

DB11to DB0

Floating-State Leakage Current

±10

mA max

Floating-State Capacitance

pF max

Output Coding

Straight (Natural) Binary

Data format bit of control register = 0.

Twos Complement

Data format bit of control register = 1.

CONVERSION RATE

Conversion Time

1.6

ms max

Track/Hold Acquisition Time

0.6

ms max

AD7891-1 hardware conversion.

0.7

ms max

AD7891-1 software conversion.

0.4

ms max

AD7891-2.

POWER REQUIREMENTS

VDD

V nom

±5% for specified performance.

IDD

Normal Mode

mA max

Standby Mode

mA max

Logic inputs = 0 V or VDD.

Power Dissipation

VDD = 5 V.

Normal Mode

100

105

mW max

Typically 82 mW.

Standby Mode

400

mW max

Typically 75

mW.

NOTES

1Temperature ranges for the A and B Versions: –40

∞C to +85∞C. Temperature range for the Y Version: –55∞C to +105∞C.

2The AD7891-1’s dynamic performance (THD and SNR) and the AD7891-2’s THD are measured with an input frequency of 10 kHz. The AD7891-2’s SNR is

evaluated with an input frequency of 100 kHz.

3This throughput rate can only be achieved when the part is operated in the parallel interface mode. Maximum achievable throughput rate in the serial interface mode

is 357 kSPS.

4See the Terminology section.

5Sample tested during initial release and after any redesign or process change that may affect this parameter.

6REF IN must be buffered before being applied to V

INXB.

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

(TA = 25

∞C, unless otherwise noted)

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Input Voltage to AGND

AD7891-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±17 V

AD7891-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5 V, +10 V

Reference Input Voltage to AGND . . . . –0.3 V to VDD + 0.3 V

Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V

Digital Output Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Commercial (A, B Versions) . . . . . . . . . . . – 40

∞C to +85∞C

Automotive (Y Version) . . . . . . . . . . . . . . –55

∞C to +105∞C

Storage Temperature Range . . . . . . . . . . . . –65

∞C to +150∞C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

∞C

MQFP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW

qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 95∞C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

∞C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

∞C

PLCC Package, Power Dissipation . . . . . . . . . . . . . . 500 mW

qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 55∞C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

∞C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

∞C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7891 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

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