IRFS3607 datasheet(1/11 Pages) KERSEMI

部件名	IRFS3607

功能描述	Advanced Process Technology

PDF	11 Pages

Scroll/Zoom	100%

制造商	KERSEMI [Kersemi Electronic Co., Ltd.]

网页	http://www.kersemi.com

标志

1 / 11 page

AUIRFS3607

AUIRFSL3607

S

D

G

VDSS

75V

RDS(on) typ.

7.34m

:

max.

9.0m:

ID

80A

D2Pak

AUIRFS3607

TO-262

AUIRFSL3607

Features

l

Advanced Process Technology

l

Low On-Resistance

l

175°C Operating Temperature

l

Fast Switching

l

Repetitive Avalanche Allowed up to Tjmax

l

Lead-Free, RoHS Compliant

l

Automotive Qualified *

Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications

is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal

resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA)

is 25°C, unless otherwise specified.

Parameter

Units

ID @ TC = 25°C

Continuous Drain Current, VGS @ 10V

ID @ TC = 100°C

Continuous Drain Current, VGS @ 10V

IDM

Pulsed Drain Current

PD @TC = 25°C

Maximum Power Dissipation

W

Linear Derating Factor

W/°C

VGS

Gate-to-Source Voltage

V

dv/dt

Peak Diode Recovery

e

V/ns

EAS (Thermally limited)

Single Pulse Avalanche Energy d

mJ

IAR

Avalanche CurrentÃ

A

EAR

Repetitive Avalanche Energy f

mJ

TJ

Operating Junction and

TSTG

Storage Temperature Range

Soldering Temperature, for 10 seconds

Thermal Resistance

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case

j

–––

1.045

RθJA

Junction-to-Ambient (PCB Mount) , D2Pak i

–––

40

Max.

80

56

310

0.96

300(1.6mm from case)

°C

A

°C/W

120

46

14

140

27

-55 to + 175

± 20

2014-8-27

1

www.kersemi.com

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