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AN533 数据表(PDF) 5 Page - STMicroelectronics |
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AN533 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 22 page ![]() AN533 Through-hole packages 5/22 Figure 2. Thermal equivalent diagram 1.1.5 TRIAC with external heatsink If the estimated junction temperature is higher than the maximum junction temperature specified in the datasheet, a heatsink has to be used. Recommendation: this calculation has to be made in the worst case scenario i.e with the maximum dissipated power, load and line voltage dispersions. We have to consider the maximum ambient temperature around the component i.e. inside the box where the TRIAC is located. The same approach as presented in the previous section allows a suitable heatsink to be defined. Figure 3 shows the thermal equivalent diagram. Figure 3. Thermal equivalent diagram with external heatsink Junction Ambient air Tj Rth(j-a) Ta Junction Heatsink Ambient air Tj Rth(j-c) Tc Rth(c-h) Th Rth(h-a) Ta Case |
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