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AN900 数据表(PDF) 4 Page - STMicroelectronics |
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AN900 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 15 page ![]() 4/15 INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY Figure 2. Diffusion and Ionic Implantation Processes Photomasking (or masking) is an operation that is repeated many times during the process. This operation is described on the above graph. This step is called photomasking because the wafer is “masked” in some areas (using a specific pattern), in the same way one “masks out” or protects the windscreens of a car before painting the body. But even if the process is some- what similar to the painting of a car body, in the case of a silicon chip the dimensions are measured in tenth of microns. The photoresist will replicate this pattern on the wafer. The ex- posed part of the photoresist is then rinsed off with a solvent (usually hydrofluoric or phos- phoric acid). Figure 3. Photomasking Process VR02103B DIFFUSION PROCESS IONIC IMPLANTATION IONIC IMPLANTER Electron Beam HIGH TEMPERATURE DIFFUSION FURNACE Doping atoms PROCESS OXIDE GROWTH DOPING DOPING SiO 2 Oxygen (O ) 2 VACUUM |
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