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AN3206 数据表(PDF) 9 Page - STMicroelectronics |
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AN3206 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 14 page ![]() AN3206 Reference design Doc ID 17406 Rev 3 9/14 using a vector network analyzer (VNA), it is easy to figure out with the help of a Smith chart the value needed to compensate the de-adaptation. In our practical case, a serial capacitor (C8) and inductor (L1) have been selected. Figure 5. Antenna matching circuit 2.2 RF layout guidelines At 2.4GHz it does not take much for a poorly designed PCB to build up enough parasitic reactance to noticeably compromise RF performance. The following notes describe how the PCB design was implemented and some of the pitfalls that could arise in transferring the design to a product. 2.2.1 PCB tolerance Volume manufacturing requires the least expensive materials to be used while meeting an acceptable level of performance. The effects of component choice have already been discussed, but the PCB also plays a major part in the matching network and so you must consider its performance. For the types of cost-sensitive applications targeted, a low-cost PCB substrate is mandatory, which means using a standard FR-4 epoxy. But within the FR4 classification there are cost trade-offs to be made against: ● Dissipation Factor, DF (also known as loss tangent, tanδ) ● Dielectric Constant, DK (also known as relative permittivity, ε r) Generally, materials are split into 'standard loss' and 'low loss' categories, with a corresponding cost penalty. Other product considerations such as flammability rating and lead-free assembly will narrow these choices. These are beyond the scope of this document. Modern PCB manufacturing achieves very accurate etching and so this is not considered as a performance variable. Z-axis expansion depends on the FR-4 material and does not alter much between vendors' material. 2.3 Other design considerations Please refer to Section 3 for the non-RF requirements of the STM32W-based design. |
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