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PM0237 数据表(PDF) 30 Page - STMicroelectronics |
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PM0237 数据表(HTML) 30 Page - STMicroelectronics |
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30 / 88 page ![]() Bluetooth low energy technology PM0237 30/88 DocID027104 Rev 2 For a detailed description of the GAP procedures, refer to the Bluetooth specification v4.0. Table 27. GAP bonding procedures Procedure Description Notes Role Bonding procedure Starts the pairing process with the bonding bit set on the pairing request. Central |
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