RF Power Amplifier IC for 2.4 GHz ISM

MA02303GJ

Specifications subject to change without notice.

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Figure 12 Evaluation Board Schematic

Mechanical Data

Application Information

List of Components

5

Discrete Components

C1 – C4 = 100 pF multilayer ceramic chip capacitor

(Dielectric Labs C11AH101K5TXL)

C5 = 2.0 pF multilayer ceramic chip capacitor

(Dielectric Labs C11AH2R0BTXL)

C6 = 1.2 pF multilayer ceramic chip capacitor

(Dielectric Labs C11AH1R2B5TXL)

R1 = 300

Ω chip resistor (P300ECT-ND)

L1 = 1.8 nH chip inductor (Toko TKS235CT-ND)

L2 = 27 nH chip inductor (Coilcraft 1008CS-270XKBB)

T1 = 0.15"

T2 = 0.21"

T3 = 0.11" (Not very critical)

T4 = 0.16"

T5 = 0.13"

T6 = 0.16"

T7 = 0.13" (Not very critical)

T8 = 0.077" (Not very critical)

T1, T2, T3, T5, T6 are 0.077" wide

T4, T7, and T8 are 0.026" wide

*The board material is 0.060" FR-4 (distance is between RF and GND) with a dielectric constant of

about 4.3 (standard FR-4)

L2

1

2

3

4

5

6

7

8

T2

C2

C4

3

C1

T1

L1

R1

T3

T4

C5

T5

C6

T6

C3

Full-Downset Paddle

To Board Ground

T7

T8

Figure 11 Component layout and printed circuit drawing for evaluation board (60 mil GETEK

board).