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RT9742ENGJ5F 数据表(PDF) 13 Page - Richtek Technology Corporation

部件名 RT9742ENGJ5F
功能描述  The RT9742 is a cost-effective
PDF  19 Pages
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制造商  RICHTEK [Richtek Technology Corporation]
网页  http://www.richtek.com
标志 RICHTEK - Richtek Technology Corporation

RT9742ENGJ5F 数据表(HTML) 13 Page - Richtek Technology Corporation

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RT9742
13
DS9742-00 July 2015
www.richtek.com
©
Copyright 2015 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
limit circuitry responds. Once this current limit threshold
is exceeded, the device enters constant current mode
until the thermal shutdown occurs or the fault is removed.
Thermal Shutdown
Thermal protection limits the power dissipation in RT9742.
When the operation junction temperature exceeds 140
°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools to 120
°C.
Power Dissipation
The junction temperature of the RT9742 series depend
on several factors such as the load, PCB layout, ambient
temperature and package type. The output pin of the
RT9742 can deliver the current of up to 3A (RT9742A/B),
2A (RT9742C/D/J), 1.5A (RT9742E/F/K/M) and 1A
(RT9742G/H/L) respectively over the full operating junction
temperature range. However, the maximum output current
must be derated at higher ambient temperature to ensure
the junction temperature does not exceed 125
°C. With
all possible conditions, the junction temperature must be
within the range specified under operating conditions.
Power dissipation can be calculated based on the output
current and the RDS(ON) of the switch as below.
PD = RDS(ON) x IOUT2
Although the devices are rated for 3A, 2A, 1.5A and 1A of
output current, but the application may limit the amount
of output current based on the total power dissipation and
the ambient temperature. The final operating junction
temperature for any set of conditions can be estimated
by the following thermal equation :
PD (MAX) = ( TJ (MAX) - TA ) / θJA
Where TJ (MAX) is the maximum junction temperature of
the die (125
°C) and TA is the maximum ambient
temperature.
The junction to ambient thermal resistance (
θJA) for TSOT-
23-5 package at recommended minimum footprint is
250
°C/W (θJA is layout dependent).
Universal Serial Bus (USB) & Power Distribution
The goal of USB is to enable device from different vendors
to interoperate in an open architecture. USB features
include ease of use for the end user, a wide range of
workloads and applications, robustness, synergy with the
PC industry, and low-cost implementation. Benefits
include self-identifying peripherals, dynamically attachable
and reconfigurable peripherals, multiple connections
(support for concurrent operation of many devices), support
for as many as 127 physical devices, and compatibility
with PC Plug-and-Play architecture.
The Universal Serial Bus connects USB devices with a
USB host: each USB system has one USB host. USB
devices are classified either as hubs, which provide
additional attachment points to the USB, or as functions,
which provide capabilities to the system (for example, a
digital joystick). Hub devices are then classified as either
Bus-Power Hubs or Self-Powered Hubs.
A Bus-Powered Hub draws all of the power to any internal
functions and downstream ports from the USB connector
power pins. The hub may draw up to 500mA from the
upstream device. External ports in a Bus-Powered Hub
can supply up to 100mA per port, with a maximum of four
external ports.
Self-Powered Hub power for the internal functions and
downstream ports does not come from the USB, although
the USB interface may draw up to 100mA from its
upstream connect, to allow the interface to function when
the remainder of the hub is powered down. The hub must
be able to supply up to 500mA on all of its external
downstream ports. Please refer to Universal Serial
Specification Revision 2.0 for more details on designing
compliant USB hub and host systems.
Over-Current protection devices such as fuses and PTC
resistors (also called polyfuse or polyswitch) have slow
trip times, high on-resistance, and lack the necessary
circuitry for USB-required fault reporting.



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