NCP708

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5

APPLICATIONS INFORMATION

Input Decoupling (Cin)

A 4.7

mF capacitor either ceramic or tantalum is

recommended and should be connected as close as possible

to the pins of NCP708 device. Higher values and lower ESR

will improve the overall line transient response.

Output Decoupling (Cout)

The minimum decoupling value is 4.7

mF and can be

augmented to fulfill stringent load transient requirements.

The regulator accepts ceramic chip capacitors MLCC. If a

tantalum capacitor is used, and its ESR is large, the loop

oscillation may result. Larger values improve noise

rejection and PSRR.

Enable Operation

The enable pin EN will turn on or off the regulator. These

limits of threshold are covered in the electrical specification

section of this data sheet. If the enable is not used then the

Hints

If their impedance is high, noise pickup or unstable

operation may result.

Set external components, especially the output capacitor,

as close as possible to the circuit.

The sense pin SNS trace is recommended to be kept as far

from noisy power traces as possible and as close to load as

possible.

Thermal

As power across the NCP708 increases, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and also the ambient

temperature affect the rate of temperature rise for the part.

This is stating that when the NCP708 has good thermal

conductivity through the PCB, the junction temperature will

be relatively low with high power dissipation.

The power dissipation across the device can be roughly

represented by the equation:

P

(eq. 1)

The maximum power dissipation depends on the thermal

resistance of the case and circuit board, the temperature

differential between the junction and ambient, PCB

orientation and the rate of air flow.

The maximum allowable power dissipation can be

calculated using the following equation:

P

q

(eq. 2)

the junction and the surrounding environment and

thermal resistance from the junction to the ambient.

Connecting the exposed pad and non connected pin 3 to

a large ground pad or plane helps to conduct away heat and

improves thermal relief.

ORDERING INFORMATION

Device

Nominal Ooutput Voltage

Package

NCP708MU330TAG

3.3 V

UDFN6 3 x 3

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.