PUSB3AB4

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© NXP Semiconductors N.V. 2015. All rights reserved.

Objective data sheet

Rev. 1 — 25 August 2015

5 of 9

NXP Semiconductors

PUSB3AB4

ESD protection for ultra high-speed interfaces

9.

Soldering

Fig 2.

Reflow soldering footprint DFN2510A-10 (SOT1176-1)

SOT1176-1

Remark:

Footprint information for reflow soldering of DFN2510A-10 package

solder land plus solder paste

occupied area

solder land

solder paste deposit

solder resist

Hx

By

Hy

0.05

C

P

D

0.05

Ay

Dimensions in mm

Ay

By

C

D

Hy

1.25

0.3

0.475

0.2

P

0.5

1.5

Hx

2.45

Generic footprint pattern

Refer to the package outline drawing for actual layout

sot1176-1_fr