LP2957ISXSLASHNOPB datasheet(2/24 Pages) TI

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using:

Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator

LP2957, LP2957A

SNVS102C – JUNE 1998 – REVISED APRIL 2013

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Absolute Maximum Ratings

(1) (2)

Operating Junction

Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 5 Seconds)

260°C

Power Dissipation(3)

Internally Limited

Input Supply Voltage

−20V to +30V

Shutdown Input

−0.3V to +30V

ESD Rating

2 kV

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of its rated operating conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation is a function of the maximum junction temperature, T J(MAX), the junction-to-ambient thermal

resistance,

θ JA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60°C/W and 73°C/W for

the DDPAK/TO-263. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper

area thermally connected to the package: Using 0.5 Square inches of copper area,

θ JA is 50°C/W, with 1 square inch of copper area,

θJA is 37°C/W; and with 1.6 or more square inches of copper area, θ JA is 32°C/W. The junction-to-case thermal resistance is 3°C/W. If

an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the junction-to-case resistance (3°C/W),

the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface between the heatsink and the

LP2957 (see Application Hints).

Electrical Characteristics

Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: VIN = 6V, IL = 1 mA, CL = 2.2 µF, VSD = 3V.

LP2957AI

LP2957I

Symbol

Parameter

Conditions

Typical

Units

Min

Max

Min

Max

5.0

4.975

5.025

4.950

5.050

Output Voltage(1)

4.940

5.060

4.900

5.100

1 mA

≤ IL ≤ 250 mA

5.0

4.930

5.070

4.880

5.120

Output Voltage

See(2)

100

150

ppm/°C

Temperature Coefficient

VIN = 6V to 30V

0.03

0.10

0.20

Line Regulation

0.20

0.40

IL = 1 mA to 250 mA

0.16

0.20

Load Regulation

0.04

IL = 0.1 mA to 1 mA

(3)

0.20

0.30

VIN–VO

IL = 1 mA

100

150

IL = 50 mA

240

300

420

Dropout Voltage(4)

IL = 100 mA

310

400

520

IL = 250 mA

470

600

800

(1)

When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped

to ground.

(2)

Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

(3)

Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested separately for load

regulation in the load ranges 0.1 mA–1 mA and 1 mA–250 mA. Changes in output voltage due to heating effects are covered by the

thermal regulation specification.

(4)

Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 100 mV below the value

measured with a 1V input to output differential.

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