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TC534CPL 数据表(PDF) 16 Page - Microchip Technology |
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TC534CPL 数据表(HTML) 16 Page - Microchip Technology |
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16 / 22 page ![]() TC530/TC534 DS21433B-page 16 © 2002 Microchip Technology Inc. 7.0 PACKAGING INFORMATION 7.1 Package Marking Information Package marking data not available at this time. 7.2 Taping Forms Component Taping Orientation for 28-Pin SOIC (Wide) Devices PIN 1 User Direction of Feed Standard Reel Component Orientation for TR Suffix Device W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 28-Pin SOIC (W) 24 mm 12 mm 1000 13 in Carrier Tape, Number of Components Per Reel and Reel Size Component Taping Orientation for 44-Pin PQFP Devices W User Direction of Feed PIN 1 Standard Reel Component Orientation for TR Suffix Device P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 44-Pin PQFP 24 mm 16 mm 500 13 in Carrier Tape, Number of Components Per Reel and Reel Size NOTE: Drawing does not represent total number of pins. |
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