CHPHT

www.vishay.com

Vishay Sfernice

Revision: 21-Jul-14

4

Document Number: 52032

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note



G terminations for temperature up to 230 °C

PERFORMANCE

TESTS

CONDITIONS

REQUIREMENTS

TYPICAL VALUES

AND DRIFTS

Termination adhesion

5N for 10 s

± (0.25 % + 0.05

)

< ± 0.1 %

Resistance to solder heat

Immersion 10 s

in Sn/Pb 60/40

at +260 °C

± (0.25 % + 0.05

)

< ± 0.1 %

Rapid temperature change

5 cycles

-55 °C to +155 °C

± (0.25 % + 0.05

)

< ± 0.1 %

Climatic sequence

Phase A dry heat

Phase B damp heat

Phase C cold -55 °C

Phase D damp heat 5 cycles

± (1 % + 0.05

)

< ± 0.2 %

Humidity (steady state)

56 days

± (1 % + 0.05

)

< ± 0.2 %

Moisture resistance

AEC-Q200

85 °C/85 % RH/Pn

1000 h

3 % + 0.05



Max. < 3 % + 0.05



Short time overload

6.25 Pn

for 2 s

± (0.25 % + 0.05

)

< ± 0.1 %

Load life

1000 h at rated power

at 230 °C

-1 % max.

Shelf life

1000 h at 245 °C

-

1 % max.

GLOBAL PART NUMBER INFORMATION

Global Part Numbering: CHPHT0805K1001FGT

GLOBAL

MODEL

SIZE

TCR

VALUE

TOLERANCE

PACKAGING

OPTION

CHPHT

0603

0805

1206

2010

K = 100 ppm

L = 200 ppm

The first 3 digits

are significant

figures and the

last digit specifies

the number of

zeros to follow.

R designates

decimal point

10R0 = 10



3901 = 3900



1004 = 1 M



F = ± 1 %

G = ± 2 %

J = ± 5 %

N: SnAg over nickel barrier

G: Gold over nickel barrier

For more

information see

“Codification of

packaging”

table

Leave blank

if no option

H

P

H

T

0805

K

C

10

0

1

F

GT