LM26CIM5-RPA datasheet(4/24 Pages) TI

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LM26

SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015

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6 Pin Configuration and Functions

DBV Package

5-Pin SOT-23

(Top View)

Pin Functions

TYPE

DESCRIPTION

NO.

NAME

HYST

Input

Hysteresis control, digital input; connect to GND for 10°C or V+ for 2°C

Power

Ground, connected to the back side of the die through lead frame; connect to

GND

system ground

Output

Analog output voltage proportional to temperature; leave floating or connect to a

VTEMP

high impedance node.

V+

Power

Supply input; connect to 2.7 V to 5.5 V with a 0.1-

μF bypass capacitor.

Output

Overtemperature Shutdown open-drain active low thermostat digital output;

connect to controller interrupt, system/power supply shutdown; pullup resistor

≥ 10

Output

Overtemperature Shutdown push-pull active high thermostat digital output;

connect to controller interrupt, system/power supply shutdown

5(1)

Output

Undertemperature Shutdown open-drain active low thermostat digital output;

connect to controller interrupt, system/power supply shutdown; pullup resistor

≥ 10

Output

Undertemperature Shutdown push-pull active high thermostat digital output;

connect to controller interrupt, system/power supply shutdown

(1)

Pin 5 functionality and trip point setting are programmed during LM26 manufacture.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltage

Input Current at any pin (2)

Package Input Current (2)

Package Dissipation at TA = 25°C

(3)

500

Vapor Phase (60 seconds)

215

Soldering

SOT-23 Package

°C

Information(4)

Infrared (15 seconds)

220

Storage Temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V

+), the current at that pin should be limited to 5 mA.

The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input

current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature),

θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is PD = (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX

= 150°C. For this device the typical thermal resistance (

θJA) of the different package types when board mounted follow:

(4)

See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

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