LM26CIM5-RPA datasheet(13/24 Pages) TI

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TEMP

L _ TEMP

DO DO

V I

)

+ Q

LM26

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SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015

11.3 Thermal Considerations

The junction to ambient thermal resistance (RθJA) is the parameter used to calculate the rise of a part's junction

temperature due to its power dissipation. For the LM26 the equation used to calculate the rise in the die junction

temperature is as follows:

where

•

TA is the ambient temperature, V

+ is the power supply voltage

•

IQ is the quiescent current, IL_TEMP is the load current on the VTEMP output

•

VDO is the voltage on the digital output

•

and IDO is the load current on the digital output

(5)

Since the LM26's junction temperature is the actual temperature being measured, care should be taken to

minimize the load current that the LM26 is required to drive.

Table 3 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26

without any loading on VTEMP and a 10-kΩ pullup resistor on an open-drain digital output with a 5.5-V power

supply.

Table 3. Thermal resistance (RθJA) and Temperature Rise Due to Self Heating (TJ−TA)

SOT-23 5 pin

no heat sink

RθJA

TJ−TA

(°C/W)

(°C)

Still Air

250

0.11

Moving Air

TBD

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