MTSF1P02HD datasheet(2/12 Pages) ONSEMI

2 / 12 page

MTSF1P02HD

http://onsemi.com

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) *

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

VDSS

Vdc

Drain−to−Gate Voltage (RGS = 1.0 MΩ)

VDGR

Vdc

Gate−to−Source Voltage − Continuous

VGS

± 8.0

Vdc

Drain Current − Continuous @ TA = 25°C (Note 2)

Drain Current − Continuous @ TA = 70°C (Note 2)

Drain Current − Pulsed Drain Current (Note 3)

IDM

1.8

1.6

14.4

Adc

Apk

Total Power Dissipation @ TA = 25°C (Note 1)

Linear Derating Factor (Note 1)

1.8

14.3

Watts

mW/

°C

Total Power Dissipation @ TA = 25°C (Note 2)

Linear Derating Factor (Note 2)

0.78

6.25

Watts

mW/

°C

Operating and Storage Temperature Range

TJ, Tstg

− 55 to 150

°C

THERMAL RESISTANCE

Rating

Symbol

Typ.

Max.

Unit

Thermal Resistance − Junction to Ambient, PCB Mount (Note 1)

Thermal Resistance − Junction to Ambient, PCB Mount (Note 2)

RθJA

125

160

°C/W

*Negative signs for P−Channel device omitted for clarity.

1. When mounted on 1

″ square FR−4 or G−10 board (VGS = 4.5 V, @ Steady State)

2. When mounted on minimum recommended FR−4 or G−10 board (VGS = 4.5 V, @ Steady State)

3. Repetitive rating; pulse width limited by maximum junction temperature.

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