LEADFRAME

Data Sheet

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to view the most current product information.

Saw MLF PEL (Plated End Lead) Package

Customer demand for Fine lead pitch (0.50 mm, 0.65 mm) is needed in the

automotive Industry. Higher solder fillet height on the side of lead area;

similar or better BLR performance than standard design; no need of X-ray

monitoring after SMD. This process is released to HVM (High Volume

Manufacturing).

FAM (Film Assist Mold) MLF Package

Better release-ability which enables complicated mold structures like cavity-

open packages (Seal film); Protection on brittle surface of die and glass lids

from mechanical impact by cavity insert on mold chase (seal film); resin/mold

flash control (adhesive film).

PQFN (Power) MLF Package

To qualify FET (Field Effect Transistor) devices in QFN package using solder

paste and copper clip; layout and packaging use copper connections for all

power paths rather than wire bonds, reducing losses due to high resistance

wire bonds as well as high inductance which cause ringing and high AC

losses.

RtMLF (Routable Molded Lead Frame) Package

An MLF® package with resin filled traces for small form factor driven

structures. This offers a low cost, high thermal performance device in a

smaller foot print. It has internal routing traces with limited line width/space

capability and this package adapts easily to flipchip configurations. rtMLF

provides higher pin count and more flexible internal trace routing with resin

filled LF. It enable small form factor, high electrical/thermal performance with

low cost.

DS572Q

Rev Date: 10/15

plastic encapsulated package with a copper leadframe

substrate. This package uses perimeter lands on the

bottom of the package to provide electrical contact to the

PWB. The package also offers Amkor's ExposedPad

technology as a thermal enhancement. Having the die

attach paddle exposed on the bottom of the package

surface provides an efficient heat path when soldered

directly to the PWB. This enhancement also enables stable

ground by use of down bonds or by electrical connection

through a conductive die attach material.

MLF Offerings

• Chip-on-Lead (COL)

• Single Row (Up to 108 I/O)

• Dual Row (Up to 180 I/O)

• Multi Chip Package

• Non-Exposed Pad

• PPF (NiPd) Punch & Saw MLF

• Small MLF (Less than 2 x 2 body size)

• Stacked Die

• Thin MicroLeadFrame®

• Top Exposed Pad (TEP)

• Inframe Cavity MLF

• Flipchip MLF

Dual Row MLF Package

An MLF package with two rows of leads offers a cost

effective, high performance solution for devices requiring

up to 180 I/O. Typical applications include hard disk drives,

USB controllers and wireless LAN.