LEADFRAME

Data Sheet

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to view the most current product information.

Thermal Performance

Multi-layer PCB

Pkg

Body Size

(mm)

# Board

Vias

Exposed

Pad (mm)

Die

(mm)

ΘJA

(°C/W)

12 ld

3 x 3

1

1.25

1.25

61.1

28 ld

5 x 5

9

2.7

2.54

34.8

44 ld

7 x 7

16

4.8

3.81

24.4

52 ld

8 x 8

25

6.1

5.08

20.9

64 ld

10 x 10

36

7.1

2.79

29.4

124 ld

10 x 10

36

7.1

2.79

30.0

JEDEC Standard Test Boards

Modeled data @ 0 air flow

Electrical Performance

Pkg

Body Size

(mm)

Lead

Inductance

(nH)

Capacitance

(pF)

Resistance

(mΩ)

12 ld

3 x 3

Longest

Shortest

0.564

0.531

0.203

0.220

141.8

138.9

44 ld

7 x 7

Longest

Shortest

1.766

1.194

0.326

0.289

315.1

234.5

64 ld

10 x 10

Longest

Shortest

2.179

1.475

0.518

0.409

337.5

250.8

Simulated Results @ 2 GHz

Values dependent on specific die and wire configurations

Reliability Qualification

Amkor devices are assembled in optimized package designs with

proven reliable semiconductor materials.

• Moisture Sensitivity

JEDEC Level 1*, 85°C/85% RH, 168 hrs

Characterization

• uHAST

130°C/85% RH, 96 hrs

• Temp/Humidity

85°C/85% RH, 1000 hours

• Temp Cycle

-65°C/+150°C, 1000 cycles

• High Temp Storage

150°C, 1000 hours

*Depending on body size

Process Highlights

• Die thickness

.20 ± .05 mm nominal, thinner for special

applications

• Plating

Matte Sn, NiPdAuAg

• Marking

Laser

Standard Materials

• Leadframe

Copper alloy, dual gauge

• Die attach

Conductive epoxy, non-conductive epoxy

or DAF

• Wire

0.8 mil Au, 1% PD doped, 0.8 mil Cu

0.8 mil Ag

• Mold compound

Pb-free/Green capable

Test Services

• Program generation/conversion

• Product engineering

• Available test/handling technology

• Burn-in capabilities

• Tape and reel services

Shipping

• Clear anti-static tubes, bakeable trays or metal canisters

Applications

The small size and weight along with excellent thermal and electrical

performance make the MicroLeadFrame package an ideal choice for

handheld portable applications such as cell phones and PDAs or any

other application where size, weight and package performance are

required.

Features

• Small size (reduce package footprint by 50% or more and improved

RF performance) and weight

• Standard leadframe process flow and equipment

• 0.4 mm to 2.03 mm maximum height

• 4 to 180 I/O

• 1-13 mm body size

• Thin profile and superior die-to-body size ratio

• Pb-free/Green

• Flexible designs for optimal electrical and thermal performance

• Saw and punch versions available

DS572Q

Rev Date: 10/15