AS3695C datasheet(39/40 Pages) AMSCO

39 / 40 page

AS3695C

austriamicrosystems

www.austriamicrosystems.com

Rev 1.11 / 2010-12-08

38 - 39

Thermal characteristic

The thermal characteristics of the devices were measured at 25°C ambient temperature. The device

was mounted on a double sided FR4 PCB with the bottom layer used as cooling area.

9.1

QFN64

10 Ordering information

Part Number

Marking

Package Type

Delivery Form

Description

AS3695C-ZMFT AS3695C

QFN64

Tape and Reel

in Dry Pack

Package size = 9x9mm, Pitch = 0.5mm,

Pb-free;

AS3695C-ZLQT AS3695C

LQFP64

Tape and Reel

in Dry Pack

Package size = 14x14mm, Pitch = 0.8mm,

Pb-free;

Bottom Layer

PCB FR4, 1cm distance from ground

Thermal vias 0.3mm

100

0,5

1,5

2,5

power dissipation

Tcase vs Power QFN64 with different copper area. Tamb = 25°C

0x0mm

10x10mm

20x20mm

30x30mm

50x50mm

70x70mm

Area [mm^2]

Rth_CA [K/W] vs Copper Area

AS3695C 数据表(PDF) 39 Page - ams AG

AS3695C 数据表(HTML) 39 Page - ams AG

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