AS3695C

austriamicrosystems

www.austriamicrosystems.com

Rev 1.11 / 2010-12-08

3 - 39

3

Electrical Characteristics

3.1

Absolute Maximum Ratings

Stresses beyond those listed may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in

Section “Electrical Characteristics” is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Symbol

Parameter

Min

Max

Unit

Note

Electrical Parameters

Supply voltage

-0.3

7

V

Applicable for pin VDD

Maximum voltage

-0.3

2.8

V

Applicable for 2.5V pins

(1)

Maximum voltage

-0.3

VDD

+0.3V

V

Applicable for 5V pins

(2)

Maximum voltage

-0.3

30

V

Applicable for 30V pins

(3)

Latch-Up immunity

-100

+100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge on all 5V

pins

(1)

-2000

2000

V

Norm: MIL 883 E Method 3015

Human body model

Electrostatic Discharge on 30V

pins

-4000

4000

V

Norm: MIL 883 E Method 3015

Human body model

Continous Power Dissipation

1.5

W

Continous Power Dissipation

Derating factor

33

mW/°

C

(5)

Temperature Ranges and Storage Conditions

Junctions temperature

+150

°C

Storage Temperature Range

-55

+150

°C

Package body temperature

260

°C

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020

“Moisture/Reflow SensitivityClassification

for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte

tin (100% Sn).

Humidity non condensing

5

85

%

Moisture Sensitive Level

3

Represents a max. floor life time of

168h

Note: (1) Pins V2_5, Filt1, Filt2

(2) Pins xRES, SDI, SCLK, SDO, xCS, VSYNC, HSYNC, VDD, xFault, FB1, FB2, G1-G16, S1-D16

(3) Pins D1 – D16

(4) Depending on actual PCB layout and PCB used

3.2

Operating Conditions

3.2.1 General

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rthja

Thermal resistance

junction – ambient

See chapter “Thermal characteristics”

°C/W

Tcase

Case Temperatur

-20

85

°C