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V23832-R511-M101 数据表(PDF) 25 Page - Infineon Technologies AG |
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V23832-R511-M101 数据表(HTML) 25 Page - Infineon Technologies AG |
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25 / 30 page ![]() V23832-T2131-M101 V23832-R121-M101 Technical Data Data Sheet 25 2003-11-19 Figure 14 PCB Layout 1. Figure 14 describes the recommended customer board layout for the PAROLI 2 modules. 2. The holes for the screwing leads and ground plates must be tied to signal ground. 3. Modules must be screwed on the 4 indicated positions (tightening torque should be typically 10 cNm). 4. Screw size for PCB or heat sink mounting = M1.6. 5. Screw length (PCB mounting) = PCB thickness + 5.2 –0.5 mm. 6. Screw length (heat sink mounting) = heat sink thickness + 3.1 –0.5 mm. 7. Modules can be mounted directly side by side. 8. The dashed lines in Figure 14 indicate the typical keep out area for straight MPO connectors as well as for the module MPO receptacle in case of central board placement of the module. File: 3508 Dimensions in mm |
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