RPC56EL60L5 datasheet(9/137 Pages) STMICROELECTRONICS

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RPC56EL60L5

Introduction

136

Modules

(cont.)

Deserial Serial Peripheral Interface (DSPI)

3 × DSPI

as many as 8 chip selects

Cyclic Redundancy Checker (CRC) unit

Yes

Junction temperature sensor (TSENS)

Yes, replicated module

Digital I/Os

 16

Supply

Device power supply

3.3 V with integrated bypassable ballast

transistor

External ballast transistor not needed for bare

die

Analog reference voltage

3.0 V – 3.6 V and 4.5 V – 5.5 V

Clocking

Frequency-modulated phase-locked loop (FMPLL)

Internal RC oscillator

16 MHz

External crystal oscillator

4 – 40 MHz

Debug

Nexus

Level 3+

Packages

LQFP

144 pins

LBGA(3)

LBGA257

Temperature

Temperature range (junction)

–40 to 150

°C

Ambient temperature range using external ballast

transistor (LQFP)

–40 to 125

°C

The third eTimer (eTimer_2) is available with external I/O access only in the BGA package, on the LQFP package eTimer_2

is available internally only without any external I/O access.

The second FlexPWM module is available only in the BGA package.

LBGA257 available only as development package.

Table 1. RPC56EL60L5 device summary (continued)

Feature

RPC56EL60

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