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STAP85025S 数据表(PDF) 9 Page - STMicroelectronics |
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STAP85025S 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 13 page ![]() DocID15795 Rev 5 9/13 STAP85025S Mounting recommendations 13 5 Mounting recommendations The STAP® product family, comprising a combination of the ubiquitous PowerSO-10™ package and a smartly designed compression clamp, provides a system to achieve superior electro-mechanical contact between the PowerSO-10 heat slug and a heatsink in traditional bolt-down applications where through-the-board mounting and removal procedures are required. The clamp is bonded to the PowerSO-10 package with a formulated epoxy. The STAP® family is not recommended and should not be considered as a stand-alone package for surface mount soldering applications. Mounting recommendations are available on www.st.com (see application note AN3232). |
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