DocID025792 Rev 2

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STC3117

Package information

34

8.1

Flip Chip CSP 1.49 x 1.594 x 0.4 mm (N5) with coating ball

printing package information

Figure 13. Flip Chip CSP 1.49 x 1.594 x 0.4 mm (N5) package mechanical drawing

1. The terminal A1 on the bump side is identified by a distinguishing feature - for instance, by a circular “clear

area” typically 0.1 mm in diameter and/or a missing bump.

2. The terminal A1, on the back side, is identified by a distinguishing feature - for instance, by a circular “clear

area” typically 0.2 mm in diameter depending on the die size.

D1

fD

e

C

B

A

SE

fE1

fE2

e

E1

3

2

1

Bottom view

Top view

E

D

ccc

C

A

A1

A2

C

Øb

$

GAMS1701141057CB

A1 (see note 1 and 2)