STM32F401 datasheet(8/135 Pages) STMICROELECTRONICS

8 / 135 page

List of figures

STM32F401xD STM32F401xE

8/135

DocID025644 Rev 3

Figure 47.

WLCSP49 0.4 mm pitch wafer level chip size recommended footprint . . . . . . . . . . . . . . 117

Figure 48.

Example of WLCSP49 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

Figure 49.

UFQFPN48, 7 x 7 mm, 0.5 mm pitch, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Figure 50.

UFQFPN48 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Figure 51.

Example of UFQFPN48 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Figure 52.

LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 122

Figure 53.

LQFP64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Figure 54.

Example of LQFP64 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Figure 55.

LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 125

Figure 56.

LQFP100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Figure 57.

Example of LQPF100 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Figure 58.

UFBGA100, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

Figure 59.

Recommended PCB design rules for pads (0.5 mm-pitch BGA) . . . . . . . . . . . . . . . . . . . 129

Figure 60.

Example of UFBGA100 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

STM32F401 数据表(PDF) 8 Page - STMicroelectronics