Reflow profile

STPTIC

10/13

DocID023772 Rev 4

4

Reflow profile

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6°C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)

Table 5. Recommended values for soldering reflow

Profile

Value

Typical

Max.

Temperature gradient in preheat (T = 70-180 °C)

0.9 °C/s

3 °C/s

Temperature gradient (T = 200-225 °C)

2 °C/s

3 °C/s

Peak temperature in reflow

240-245 °C

260 °C

Time above 220 °C

60 s

90 s

Temperature gradient in cooling

-2 to -3 °C/s

-6 °C/s

Time from 50 to 220 °C

160 to 220 s