DocID023772 Rev 4

5/13

STPTIC

Package information

13

3

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 2. µQFN-6L package dimension

Figure 3. Recommended PCB land pattern for µQFN-6L package

C2

C1

C2

A2

B2

B1

C1

A1

1.2 mm

0.05 mm

±

0.7 mm

0.425 mm

0.35 mm

± 0.03 mm

0.9 mm

± 0.1 mm

0.25 mm

± 0.03 mm

0.5 mm

550 µm

600 µm

300 µm

Top Metal

NC

RF1

RF1

Bias

NC

RF2

Solder mask opening

RF1

RF2

RF1

250 µm

300 µm

200 µm