STBP110

Maximum rating

Doc ID 018687 Rev 3

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Maximum rating

Stressing the device above the rating listed in Table 2 may cause permanent damage to the

device. These are stress ratings only and operation of the device at these or any other

conditions above those indicated in Section 3 of this specification is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability. Refer

also to the STMicroelectronics™ SURE Program and other relevant documentation.

Table 2.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

-55 to 150

°C

(1)

1.

Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds

260

°C

-40 to 150

°C

IN pin input voltage

-0.3 to 30

V

OUT pin input/output voltage

-0.3 to 12

V

Input/output voltage (other pins)

-0.3 to 7

V

Load current (IN to OUT)

1200

mA

Reverse diode current (OUT to IN)

500

mA

FLT pin sink current

15

mA

2.

System-level value (see typical application circuit, C1

≥ 1 µF low ESR ceramic capacitor).

±15 (air),

±8 (contact)

kV

3.

Human body model, 100 pF discharged through a 1.5 k

Ω resistor according to the JESD22/A114

specification.

2000

V

4.

Machine model, 200 pF discharged through all pins according to the JESD22/A115 specification.

200

V

Table 3.

Thermal data

Symbol

Parameter

Value

Unit

Thermal resistance (junction-to-ambient)

1.

The package was mounted on a 4-layer JEDEC test board with 2 thermal vias connecting from the thermal

land to the first buried plane. The 4-layer PCB (2S2P) was constructed based on JESD 51-7 specifications

and vias based on JESD 51-5.

°C/W

Thermal resistance (junction-to-case)

5.9

°C/W