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STF35N60DM2 数据表(PDF) 3 Page - STMicroelectronics |
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STF35N60DM2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 13 page ![]() STF35N60DM2 Electrical ratings DocID028365 Rev 1 3/13 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID (1) Drain current (continuous) at Tcase = 25 °C 28 A Drain current (continuous) at Tcase = 100 °C 17 IDM (2) Drain current (pulsed) 112 A PTOT Total dissipation at Tcase = 25 °C 40 W dv/dt (3) Peak diode recovery voltage slope 50 V/ns dv/dt (4) MOSFET dv/dt ruggedness 50 VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; Tc = 25 °C) 2.5 kV Tstg Storage temperature -55 to 150 °C Tj Operating junction temperature Notes: (1) Limited by maximum junction temperature. (2) Pulse width is limited by safe operating area. (3) ISD ≤ 28 A, di/dt=900 A/μs; VDS peak < V(BR)DSS,VDD = 400 V (4) VDS ≤ 480 V. Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 3.1 °C/W Rthj-amb Thermal resistance junction-amb 62.5 Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive 6 A EAS (1) Single pulse avalanche energy 650 mJ Notes: (1) starting Tj = 25 °C, ID = IAR, VDD = 50 V. |
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