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STF35N60DM2 数据表(PDF) 5 Page - STMicroelectronics

部件名 STF35N60DM2
功能描述  Extremely high dv/dt ruggedness
PDF  13 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STF35N60DM2 数据表(HTML) 5 Page - STMicroelectronics

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STF35N60DM2
Electrical characteristics
DocID028365 Rev 1
5/13
Table 7: Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on
delay time
VDD = 300 V, ID = 14 A RG = 4.7 Ω,
VGS = 10 V (see Figure 14: "Test circuit for
resistive load switching times" and Figure 19:
"Switching time waveform")
-
21.2
-
ns
tr
Rise time
-
17
-
td(off)
Turn-off
delay time
-
68
-
tf
Fall time
-
10.7
-
Table 8: Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain
current
-
28
A
ISDM
(1)
Source-drain
current
(pulsed)
-
112
A
VSD
(2)
Forward on
voltage
VGS = 0 V, ISD = 28 A
-
1.6
V
trr
Reverse
recovery time
ISD = 28 A, di/dt = 100 A/µs, VDD = 60 V
(see Figure 16: "Test circuit for inductive
load switching and diode recovery times")
-
120
ns
Qrr
Reverse
recovery
charge
-
572
nC
IRRM
Reverse
recovery
current
-
10.2
A
trr
Reverse
recovery time
ISD = 28 A, di/dt = 100 A/µs, VDD = 60 V,
Tj = 150 °C (see Figure 16: "Test circuit for
inductive load switching and diode
recovery times")
-
215
ns
Qrr
Reverse
recovery
charge
-
1.89
µC
IRRM
Reverse
recovery
current
-
17.7
A
Notes:
(1)
Pulse width is limited by safe operating area.
(2)
Pulse test: pulse duration = 300 µs, duty cycle 1.5%.
Table 9: Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V(BR)GSO
Gate-source breakdown voltage
IGS = ±250 µA, ID = 0 A
±30
-
-
V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD
performance of the device. The Zener voltage facilitates efficient and cost-effective device
integrity protection, thus eliminating the need for additional external componentry.



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