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UT700 数据表(PDF) 29 Page - Aeroflex Circuit Technology |
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UT700 数据表(HTML) 29 Page - Aeroflex Circuit Technology |
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29 / 46 page ![]() 29 36-00-00-000 Ver. 1.3.1 Aeroflex Microelectronics Solutions - HiRel 4.2 Output Timing Characteristics for Memory Interface, ERROR, and WDOG (VDD = 3.3V + 0.3V; VDDC = 1.2V + 0.1V; TC = -55 oC to 105oC) Notes: 1. All outputs are measured using the load conditions shown in Figure 17. 2. CB[7] is not tested in the case of BCH EDAC. 3. High-Z defined as +/-300mV change from steady state. 4. Guaranteed by design. Symbol Description Min Max Units t1a1 SDCLK ↑ to ADDR[27:0] valid 1.5 8.5 ns t1b1 SDCLK ↑ to SDCS[1:0] valid 2 7.5 ns t1c1 SDCLK ↑ to output valid SDRAS, SDCAS, and SDWE 1.5 8.5 ns t1d1 SDCLK ↑ to SDDQM[3:0] valid 2.5 8.5 ns t1e1 SDCLK ↑ to output valid (WRITE, OE, IOS, ROMS[1:0], RWE [3:0], RAMOE [4:0], RAMS[4:0], and READ) 18 ns t21,2 SDCLK ↑ to output valid (DATA[31:0] and CB[15:0]) 2.5 8.5 ns t31,2,3 SDCLK ↑ to output high-Z (DATA[31:0] and CB[15:0]) 2.5 8.5 ns t41 SDCLK ↑ to signal low (ERROR and WDOG4) -- 10 ns t81,2,3 WRITE ↑ or RWE[3:0]↑ to output high-z (DATA [31:0] and CB[15:0]) 0.5 -- ns t91 Skew from first memory output signal transition to last memory output signal transition -- 2 ns |
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