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UT8SF2M40MCPC 数据表(PDF) 21 Page - Aeroflex Circuit Technology |
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UT8SF2M40MCPC 数据表(HTML) 21 Page - Aeroflex Circuit Technology |
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21 / 23 page ![]() 21 36-00-01-00 5 Ver. 1.0.0 Aeroflex Microelectronics Solutions - HiRel 2M x 40 SSRAM: SMD Lead Finish: (Note 1) (C) = Gold (F) = Solder Case Outline: (X) = 288-Lead Ceramic Land Grid Array (CLGA) (F) = 288-Lead Ceramic Column Grid Array (CCGA) Class Designator: (Q) = QML Class Q (In development, contact factory) Device Type: (Note 2) (01) = fmax = 80MHz, QML Q only (Temperature Range: -55 °C to +105°C) (02) = fmax = 80MHz Aeroflex Q+ Flow (Temperature Range -55 °C to +105°C) Drawing Number: (TBD) = 2M x 40 SSRAM Total Dose: (R) = 100 krad(Si) Federal Stock Class Designator: No options Notes: 1. Lead finish is per the table below. 2. Aeroflex’s Q+ assembly flow, as defined in section 4.2.2.d of the SMD, provides QML-Q product through the SMD that is manufactured with Aeroflex’s QML-V flow. 5962 * ***** ** ** * Package Option Associated Lead Finish Option (X) 288-CLGA (C) Gold (F) 288-CCGA (F) Hot Solder Dipped |
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