TUSB321AI

SLLSER2 – OCTOBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

6.0

V

CC1, CC2, PORT, CURRENT_MODE, ID, DIR, VCONN_FAULT

–0.3

Control pins

OUT1, OUT2

–0.3

V

VBUS_DET

–0.3

4

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

4.5

5.5

V

4

5

28

V

DC Voltage range for VBUS_DET

VBUS_DET

0

4

V

ID, DIR, VCONN_FAULT, OUT1, OUT2,

DC Voltage range for control pins

0

5.5

V

CURRENT_MODE, CC1, CC2, PORT

4.75

5.5

V

–40

25

85

°C

6.4 Thermal Information

TUSB321AI

RWB (X2QFN)

UNIT

12 PINS

Junction-to-ambient thermal resistance

169.3

°C/W

Junction-to-case (top) thermal resistance

68.1

°C/W

Junction-to-board thermal resistance

83.4

°C/W

Junction-to-top characterization parameter

2.2

°C/W

Junction-to-board characterization parameter

83.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

—

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report, SPRA953.

4

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