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LP5907 数据表(PDF) 2 Page - Texas Instruments |
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LP5907 数据表(HTML) 2 Page - Texas Instruments |
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2 / 36 page ![]() 2 LP5907 SNVS798J – APRIL 2012 – REVISED MARCH 2016 www.ti.com Product Folder Links: LP5907 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 5 6.5 Electrical Characteristics........................................... 5 6.6 Output and Input Capacitors ..................................... 6 6.7 Typical Characteristics .............................................. 7 7 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 11 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 12 8 Applications and Implementation ...................... 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 9 Power Supply Recommendations ...................... 16 10 Layout................................................................... 17 10.1 Layout Guidelines ................................................. 17 10.2 Layout Examples................................................... 17 10.3 X2SON Mounting .................................................. 18 10.4 DSBGA Mounting.................................................. 18 10.5 DSBGA Light Sensitivity ....................................... 18 11 Device and Documentation Support ................. 19 11.1 Documentation Support ........................................ 19 11.2 Community Resources.......................................... 19 11.3 Trademarks ........................................................... 19 11.4 Electrostatic Discharge Caution ............................ 19 11.5 Glossary ................................................................ 19 12 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (August 2015) to Revision J Page • Changed VOUT min and max values and VEN min value in Abs Max table and VEN row of ROC table to correct format errors; replace text of footnote 2 of Abs Max table ............................................................................................................... 4 Changes from Revision H (November 2014) to Revision I Page • Added icon for reference design to Top Navs and " ΔVOUT vs Temperature" graph to Typical Characteristics ..................... 1 • Changed Storage Temperature to Abs Max table; replace Handling Ratings with ESD Ratings ......................................... 4 • Deleted "VOUT ≥ 1.8 V" from first row of ΔVout spec ............................................................................................................. 5 • Added "SOT-23, X2SON packages" to second row of ΔVout spec ...................................................................................... 5 Changes from Revision G (October 2013) to Revision H Page • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1 |
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