EN

IN

OUT

GND

1 PF

1 PF

INPUT

ENABLE

GND

OUTPUT

LP5907

Copyright © 2016, Texas Instruments Incorporated

13

LP5907

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SNVS798J – APRIL 2012 – REVISED MARCH 2016

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Copyright © 2012–2016, Texas Instruments Incorporated

8 Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LP5907 is designed to meet the requirements of RF and analog circuits, by providing low noise, high PSRR,

low quiescent current, and low line or load transient response figures. The device offers excellent noise

performance without the need for a noise bypass capacitor and is stable with input and output capacitors with a

value of 1 µF. The LP5907 delivers this performance in industry standard packages such as DSBGA, X2SON,

8.2 Typical Application

Figure 21 shows the typical application circuit for the LP5907. Input and output capacitances may need to be

increased above the 1 µF minimum for some applications.

Figure 21. LP5907 Typical Application

8.2.1 Design Requirements

DESIGN PARAMETER

EXAMPLE VALUE

Input voltage range

2.2 V to 5.5 V

Output voltage

1.8 V

Output current

200 mA

Output capacitor range

0.7 µF to 10 µF

Input/Output capacitor ESR range

5 to 500 m

Ω

8.2.2 Detailed Design Procedure

8.2.2.1 Power Dissipation and Device Operation

The permissible power dissipation for any package is a measure of the capability of the device to pass heat from

the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power

dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces

between the die junction and ambient air.