LP38513 datasheet(4/25 Pages) TI1

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LP38513

SNVS361E – JULY 2007 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

IN pin voltage (survival)

−0.3

EN pin voltage (survival)

−0.3

OUT pin Voltage (survival)

−0.3

ERROR pin voltage (survival)

−0.3

IOUT (Survival)

Internally limited

Power dissipation(3)

Internally limited

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum

allowable operating junction temperature (TJ(MAX)), and package thermal resistance (RθJA).

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input supply voltage, VIN

2.25

5.5

Enable input voltage, VEN

5.5

ERROR pin voltage

VIN

Output current (DC)

mA/A

Junction temperature(2)

−40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum

allowable operating junction temperature (TJ(MAX)), and package thermal resistance (RθJA).

6.4 Thermal Information

LP38513

THERMAL METRIC(1)

NDH (TO-220)

KTT (DDPAK/TO-263)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

31.9

32.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

43.7

37.6

°C/W

RθJB

Junction-to-board thermal resistance

16.4

18.9

°C/W

ψJT

Junction-to-top characterization parameter

8.3

5.7

°C/W

ψJB

Junction-to-board characterization parameter

16.4

17.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.2

1.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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