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ADC0803 数据表(PDF) 23 Page - National Semiconductor (TI) |
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ADC0803 数据表(HTML) 23 Page - National Semiconductor (TI) |
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23 / 41 page ![]() Functional Description (Continued) Heavy capacitive or DC loading of the clock R pin should be avoided as this will disturb normal converter operation. Loads less than 50 pF, such as driving up to 7 A/D converter clock inputs from a single clock R pin of 1 converter, are al- lowed. For larger clock line loading, a CMOS or low power TTL buffer or PNP input logic should be used to minimize the loading on the clock R pin (do not use a standard TTL buffer). 2.7 Restart During a Conversion If the A/D is restarted (CS and WR go low and return high) during a conversion, the converter is reset and a new con- version is started. The output data latch is not updated if the conversion in process is not allowed to be completed, there- fore the data of the previous conversion remains in this latch. The INTR output simply remains at the “1” level. 2.8 Continuous Conversions For operation in the free-running mode an initializing pulse should be used, following power-up, to ensure circuit opera- tion. In this application, the CS input is grounded and the WR input is tied to the INTR output. This WR and INTR node should be momentarily forced to logic low following a power-up cycle to guarantee operation. 2.9 Driving the Data Bus This MOS A/D, like MOS microprocessors and memories, will require a bus driver when the total capacitance of the data bus gets large. Other circuitry, which is tied to the data bus, will add to the total capacitive loading, even in TRI-STATE (high impedance mode). Backplane bussing also greatly adds to the stray capacitance of the data bus. There are some alternatives available to the designer to handle this problem. Basically, the capacitive loading of the data bus slows down the response time, even though DC specifications are still met. For systems operating with a relatively slow CPU clock frequency, more time is available in which to establish proper logic levels on the bus and there- fore higher capacitive loads can be driven (see typical char- acteristics curves). At higher CPU clock frequencies time can be extended for I/O reads (and/or writes) by inserting wait states (8080) or using clock extending circuits (6800). Finally, if time is short and capacitive loading is high, external bus drivers must be used. These can be TRI-STATE buffers (low power Schottky such as the DM74LS240 series is rec- ommended) or special higher drive current products which are designed as bus drivers. High current bipolar bus drivers with PNP inputs are recommended. 2.10 Power Supplies Noise spikes on the V CC supply line can cause conversion errors as the comparator will respond to this noise. A low in- ductance tantalum filter capacitor should be used close to the converter V CC pin and values of 1 µF or greater are rec- ommended. If an unregulated voltage is available in the sys- tem, a separate LM340LAZ-5.0, TO-92, 5V voltage regulator for the converter (and other analog circuitry) will greatly re- duce digital noise on the V CC supply. 2.11 Wiring and Hook-Up Precautions Standard digital wire wrap sockets are not satisfactory for breadboarding this A/D converter. Sockets on PC boards can be used and all logic signal wires and leads should be grouped and kept as far away as possible from the analog signal leads. Exposed leads to the analog inputs can cause undesired digital noise and hum pickup, therefore shielded leads may be necessary in many applications. A single point analog ground that is separate from the logic ground points should be used. The power supply bypass ca- pacitor and the self-clocking capacitor (if used) should both be returned to digital ground. Any V REF/2 bypass capacitors, analog input filter capacitors, or input signal shielding should be returned to the analog ground point. A test for proper grounding is to measure the zero error of the A/D converter. Zero errors in excess of 1⁄4 LSB can usually be traced to im- proper board layout and wiring (see section 2.5.1 for mea- suring the zero error). 3.0 TESTING THE A/D CONVERTER There are many degrees of complexity associated with test- ing an A/D converter. One of the simplest tests is to apply a known analog input voltage to the converter and use LEDs to display the resulting digital output code as shown in Figure 9. For ease of testing, the V REF/2 (pin 9) should be supplied with 2.560 V DC andaVCC supply voltage of 5.12 VDC should be used. This provides an LSB value of 20 mV. If a full-scale adjustment is to be made, an analog input volt- age of 5.090 V DC (5.120– 1 1 ⁄2 LSB) should be applied to the V IN(+) pin with the VIN(−) pin grounded. The value of the V REF/2 input voltage should then be adjusted until the digital output code is just changing from 1111 1110 to 1111 1111. This value of V REF/2 should then be used for all the tests. The digital output LED display can be decoded by dividing the 8 bits into 2 hex characters, the 4 most significant (MS) and the 4 least significant (LS). Table 1 shows the fractional binary equivalent of these two 4-bit groups. By adding the voltages obtained from the “VMS” and “VLS” columns in Table 1, the nominal value of the digital display (when V REF/2 = 2.560V) can be determined. For example, for an output LED display of 1011 0110 or B6 (in hex), the voltage values from the table are 3.520 + 0.120 or 3.640 V DC. These voltage values represent the center-values of a perfect A/D converter. The effects of quantization error have to be ac- counted for in the interpretation of the test results. DS005671-17 FIGURE 8. Self-Clocking the A/D www.national.com 23 |
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