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CLC451 数据表(PDF) 9 Page - National Semiconductor (TI) |
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CLC451 数据表(HTML) 9 Page - National Semiconductor (TI) |
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9 / 12 page ![]() 9 http://www.national.com Figure 8: Dual Supply, Av = +1V/V Configuration Figure 9: Dual Supply, Av = +2V/V Configuration Bandwidth vs. Output Amplitude The bandwidth of the CLC451 is at a maximum for output voltages near 1Vpp. The bandwidth decreases for smaller and larger output amplitudes. Refer to the Frequency Response vs. Vo plots. Load Termination The CLC451 can source and sink near equal amounts of current. For optimum performance, the load should be tied to Vcm. Driving Cables and Capacitive Loads When driving cables, double termination is used to prevent reflections. For capacitive load applications, a small series resistor at the output of the CLC451 will improve stability and settling performance. The Frequency Response vs. CL and Recommended Rs vs. CL plots, in the typical performance section, give the recommended series resistance value for optimum flatness at various capacitive loads. Transmission Line Matching One method for matching the characteristic impedance (Zo) of a transmission line or cable is to place the appropriate resistor at the input or output of the amplifier. Figure 10 shows typical inverting and non-inverting circuit configurations for matching transmission lines. Non-inverting gain applications: s Connect pin 2 as indicated in the table in the Closed Loop Gain Selection section. s Make R1, R2, R6, and R7 equal to Zo. s Use R3 to isolate the amplifier from reactive loading caused by the transmission line, or by parasitics. Inverting gain applications: s Connect R3 directly to ground. s Make the resistors R4, R6, and R7 equal to Zo. s Make R5 II Rg = Zo. The input and output matching resistors attenuate the signal by a factor of 2, therefore additional gain is needed. Use C6 to match the output transmission line over a greater frequency range. C6 compensates for the increase of the amplifier’s output impedance with frequency. Figure 10: Transmission Line Matching Power Dissipation Follow these steps to determine the power consumption of the CLC451: 1. Calculate the quiescent (no-load) power: Pamp = ICC (VCC - VEE) 2. Calculate the RMS power at the output stage: Po = (VCC - Vload) (Iload), where Vload and Iload are the RMS voltage and current across the external load. 3. Calculate the total RMS power: Pt = Pamp + Po The maximum power that the DIP, SOIC, and SOT packages can dissipate at a given temperature is illustrated in Figure 11. The power derating curve for any CLC451 package can be derived by utilizing the following equation: where Tamb = Ambient temperature (°C) θ JA = Thermal resistance, from junction to ambient, for a given package (°C/W) (175 Tamb JA °− ) θ 0.1 µF 6.8 µF Vo Vin Rt + VCC 1 CLC451 7 6 8 5 3 4 2 1k Ω 1k Ω 0.1 µF 6.8 µF + VEE 0.1 µF 6.8 µF Vo Vin Rt + VCC 1 CLC451 7 6 8 5 3 4 2 1k Ω 1k Ω 0.1 µF 6.8 µF + VEE Z0 R6 Vo Z0 R4 R5 + - R3 Z0 R1 R2 V1 V2 +- C6 R7 1 CLC451 7 6 8 5 3 4 2 1k Ω 1k Ω |
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