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MAX20002CATPC 数据表(PDF) 17 Page - Maxim Integrated Products |
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MAX20002CATPC 数据表(HTML) 17 Page - Maxim Integrated Products |
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17 / 19 page ![]() PCB Layout Guidelines Careful PCB layout is critical to achieve low switching losses and clean, stable operation. Use a multilayer board whenever possible for better noise immunity and power dissipation. Follow these guidelines for good PC board layout: 1) Use a large contiguous copper plane under the device package. Ensure that all heat-dissipating components have adequate cooling. The bottom pad of the devices must be soldered down to this copper plane for effective heat dissipation and getting the full power out of the devices. Use multiple vias or a single large via in this plane for heat dissipation 2) Isolate the power components and high current path from the sensitive analog circuitry. This is essential to prevent any noise coupling into the analog signals. 3) Keep the high-current paths short, especially at the ground terminals. This practice is essential for stable, jitter-free operation. The high current path compris- ing of input capacitor, high-side FET, inductor, and the output capacitor should be as short as possible. 4) Keep the power traces and load connections short. This practice is essential for high efficiency. Use thick copper PCBs (2oz vs. 1oz) to enhance full-load efficiency. 5) The analog signal lines should be routed away from the high-frequency planes. This ensures integrity of sensitive signals feeding back into the IC. 6) The ground connection for the analog and power section should be close to the IC. This keeps the ground current loops to a minimum. In cases where only one ground is used, adequate isolation between analog return signals and high-power signals must be maintained. www.maximintegrated.com Maxim Integrated │ 17 MAX20002/MAX20003 36V, 220kHz to 2.2MHz, 2A/3A Fully Integrated Step-Down Converters with 15μA Operating Current |
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