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CPC1908J 数据表(PDF) 6 Page - IXYS Corporation

部件名 CPC1908J
功能描述  Machine Insertable, Wave Solderable
PDF  7 Pages
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制造商  IXYS [IXYS Corporation]
网页  http://www.ixys.com
标志 IXYS - IXYS Corporation

CPC1908J 数据表(HTML) 6 Page - IXYS Corporation

  CPC1908J Datasheet HTML 1Page - IXYS Corporation CPC1908J Datasheet HTML 2Page - IXYS Corporation CPC1908J Datasheet HTML 3Page - IXYS Corporation CPC1908J Datasheet HTML 4Page - IXYS Corporation CPC1908J Datasheet HTML 5Page - IXYS Corporation CPC1908J Datasheet HTML 6Page - IXYS Corporation CPC1908J Datasheet HTML 7Page - IXYS Corporation  
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INTEGRATED CIRCUITS DIVISION
R10
www.ixysic.com
6
CPC1908
4
Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1908J
MSL 1
Device
Maximum Temperature x Time
CPC1908J
245°C for 30 seconds
e3



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