DAC7545LP datasheet(2/13 Pages) TI1

2 / 13 page

DAC7545

SBAS150A

www.ti.com

ABSOLUTE MAXIMUM RATINGS(1)

A = +25°C, unless otherwise noted.

VDD to DGND ........................................................................... –0.3V, +17

Digital Input to DGND ............................................................... –0.3V, VDD

VRFB, VREF, to DGND ........................................................................ ±25V

VPIN 1 to DGND ........................................................................ –0.3V, VDD

AGND to DGND ........................................................................ –0.3V, VDD

Power Dissipation: Any Package to +75

°C .................................... 450mW

Derates above +75

°C by ................................ 6mW/°C

Operating Temperature:

Commercial J, K, L, and GL ........................................... –40

°C to +85°C

Storage Temperature ...................................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTE: (1) Stresses above those listed above may cause permanent damage to

the device. This is a stress rating only and functional operation of the device at

these or any other condition above those indicated in the operational sections of

this specification is not implied. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

SPECIFIED

RELATIVE

GAIN ERROR (LSB)

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

ACCURACY (LSB)

VDD = +5V

PACKAGE-LEAD DESIGNATOR(1)

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

DAC7545

±2

±20

SO-20

–40

°C to +85°C DAC7545JU

DAC7545JU

Rails, 38

±1

±10

DAC7545KU

Rails, 38

DAC7545

±1/2

±5

SO-20

–40

°C to +85°C DAC7545LU

DAC7545LU

Rails, 38

±1/2

±2

DAC7545GLU DAC7545GLU

Rails, 38

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

PACKAGE/ORDERING INFORMATION

PIN CONNECTIONS

DAC7545

OUT 1

AGND

DGND

(MSB) DB

REF

0 (LSB)

Top View

WRITE CYCLE TIMING DIAGRAM

Mode Selection

Write Mode

Hold Mode

CS and WR low, DAC responds

Either CS or WR high, data bus to

Data Bus (DB0-DB11) inputs.

(DB0-DB11) is locked out; DAC

holds last data present when

WR or CS assumed high state.

NOTES: VDD = +5V, tR = tF = 20ns. VDD = +15V, tR = tF = 40ns. All inputs signal

rise and fall times measured from 10% to 90% of VDD. Timing measurement

reference level is (VIH + VIL)/2.

Data

Valid

Data In

(DB

0-DB11)

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