Gull Wing Leads

Option

0.135 ref. (3.43)

Gull wing leads are solder dipped.

Lead dimensions are prior to solder dip.

0.08

(2.0)

0.010 (0.25)

Bottom of case to

bottom of lead

0.055

(1.40)

0.070

(1.78)

0.08 (2.0)

1.140 ref. (28.96)

1

1

TOP VIEW CASE B FMGA

0.880 max

(22.35)

1.010 max

(25.65)

0.010

(0.25)

1.870 ref. (47.50)

0.015

(0.38)

0.010

(0.25)

0.900 (22.86)

0.800 (20.32)

0.700 (17.78)

0.600 (15.24)

0.500 (12.70)

0.400 (10.16)

0.300 ( 7.62)

The triangle (ESD) marking on the cover indicates pin one. Cover marking is oriented

with pin one at the upper right corner. The straight lead configuration does not

require a “case designator” in the model number. ex. FMGA-461

1

2

3

4

5

6

8

9

7

18

17

16

15

14

13

12

11

10

0.000

Straight Leads

0.50

(12.7)

0.250 max.

(6.35)

0.200 ( 5.08)

0.100 ( 2.54)

Seam seal

Seal hole: 0.040 ±0.002 (1.02 ±0.05)

Weight: 12 grams maximum

Case dimensions in inches (mm)

Tolerance±0.005 (0.13) for three decimal places, ±0.01 (0.3) for two

dimensions for accuracy.

CAUTION

Maximum reflow temperature is 220°C for a maximum of 30 seconds.

SN60, SN62, or SN63 are the recommended types of solder. See MGH

gull-wing solder pad layout. Hand soldering should not exceed 300°C for

10 seconds per pin.

Materials

Header Kovar/Nickel/Gold

Cover

Kovar/Nickel

Pins

Kovar/Nickel/Gold matched glass seal

Gold plating of 50 - 150 microinches is included in pin diameter

Case B FMGA, Rev E, 2015.12.09

(This view shows

straight leads.)

(Center to center)

The gull wing option

(configuration) requires

“Z” as a “case

designator”

in the model number.

ex. FMGA-461Z

0.830 (21.08)

0.070 (1.78)

0.090 (2.29)

0.030 (0.76) 18X

0.085 (2.16) 4X

0.100 (2.54) 16X

Case B1 FMGA Solder Pads, Rev F, 2013.05.31

CASE B1 GULL-WING SOLDER PADS FMGA CASE Z

Dimensions in inches (mm)

Tolerance±0.005 (0.13) for three decimal places ±0.01 (0.3) for

two decimal places, unless otherwise specified.

Please refer to the numerical dimensions for accuracy.

CAUTION:

Internal components are soldered with SN96 (melting

temperature 221°C) to prevent damage during reflow. Maximum

reflow temperature for surface mounting the FMGA filter is

220°C for a maximum of 30 seconds. SN60, 62, or 63 are the

recommended types of solder.

Hand soldering should not exceed 300°C for 10 seconds per pin.

SOLDER MASK NOTES

1. Pad dimensions are for the solder mask. Leads common to

each other can be connected to each other as desired.

2. Ground (case) pins should be connected to the center pad for

improved grounding.

3. Connect "no connection" pins to case ground to reduce EMI.

4. Center pad should not have a solder mask.

5. Adhesive attach is intended to be a surface for soldering the

hybrid to the circuit board.

6. Pre-tin base of converter prior to soldering.

7. If less rotation of case is desired, reduce the width of the large

case pad by 0.020 inches (0.51 mm). Pad length can be

extended 0.010 inches (0.25 mm) towards the case body and an

as-desired dimension away from the case body.

8. Do not exceed 220°C as measured on the body of the

converter (top or bottom).

9. Attach the body of the case to the board with a thermally

conductive adhesive or SN60, 62, or 63 solder. The adhesive

can be electrically conductive as well. It can be applied as an

underfill post solder or dispensed and cured prior or during

solder.

10. In the presence of vibration, to ensure reliable mechanical

attachment, the body of the case should be attached with

adhesive or solder as noted above (note 7). The leads alone do

not provide sufficient mechanical attachment.

Crane Aerospace & Electronics Power Solutions

FMSA/FMGA eMi input Filters

28 VOlt iNput - 0.8 AMp

www.craneae.com/interpointcom

Page 12 of 14

FMSA/FMGA Rev AA - 2015.12.15