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R03

IX2204

5.5 Mechanical Dimensions

5.5.1 IX2204NE 16-Pin Narrow SOIC Package

5.5.2 IX2204NETR Tape & Reel Packaging for 16-Pin Narrow SOIC Package (TBD)

NOTES:

1. All dimensions are MM (IN)

2. Reference JEDEC outline: MS-012 BC Rev F. (Thermal)

3. Dimension does not include mold flash, protrusions,

or gate burrs. Mold flash, protrusions, and gate burrs

shall not exceed 0.15 (0.006) per side.

4. Dimension does not include inter-lead flash, and

protrusions shall not exceed 0.25 (0.010) per side.

DIMENSIONS

mm

(inches)

9.90 BSC

(0.390 BSC)

See Note 3

1.27 TYP

(0.05 TYP)

0.31 - 0.51

(0.012 - 0.020)

3.90 BSC

(0.154 BSC)

See Note 4

1.25 min

(0.049 min)

0.00 - 0.15

(0.000 - 0.006)

1.70 max

(0.067 max)

6.00 ± 0.50 BSC

(0.236 ± 0.020 BSC)

0.20 TYP

(0.008 TYP)

0.80 ± 0.50

(0.031 ± 0.020)

0º - 8º

3.86 - 4.57

(0.152 - 0.180)

1.68 - 2.41

(0.066 - 0.095)

Recommended PCB Pattern

5.50

(0.217)

1.70

(0.059)

0.60

(0.024)

1.27

(0.05)

4.55

(0.179)

2.40

(0.094)

Dimensions

mm

(inches)

NOTES:

1.10 Sprocket hole pitch cumulative tolerance ±0.2

2. Camber in compliance with EIA 481

3. Pocket position relative to sprocket hole measured

as true position of pocket, not pocket hole

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

K

(0.083 ± 0.004)

0.30 ± 0.05

(0.012 ± 0.002)

R 0.3 max

2.00 ± 0.10 Note 3

(0.079 ± 0.004)

4.00 Note 1

(0.157)

8.00 ± 0.10

(0.315 ± 0.004)

∅ 1.5 +0.1 / -0.0

∅ 1.50 min

R 0.5 typ

A

A

Section A-A

1.75 ± 0.10

(0.069 ± 0.004)

7.5 ± 0.10 Note 3

(0.295 ± 0.004)

A

(0.256 ± 0.004)

B

(0.406 ± 0.004)

16.0 ± 0.3

(0.63 ± 0.012)

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IX2204-R03

©Copyright 2014, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

11/11/2014