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LM26LVCISDX-085/NOPB 数据表(PDF) 3 Page - Texas Instruments

部件名 LM26LVCISDX-085/NOPB
功能描述  1.6 V, WSON-6 Factory Preset Temperature Switch and Temperature Sensor
PDF  33 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

LM26LVCISDX-085/NOPB 数据表(HTML) 3 Page - Texas Instruments

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VDD
GND
VSENSE
GND
VDD
GND
VDD
GND
1 PA
LM26LV
www.ti.com
SNIS144F – JULY 2007 – REVISED FEBRUARY 2013
Pin Descriptions
Pin
Name
Type
Equivalent Circuit
Description
No.
TRIP TEST pin. Active High input.
If TRIP TEST = 0 (Default) then:
VTEMP = VTS, Temperature Sensor Output Voltage
TRIP
Digital
1
If TRIP TEST = 1 then:
TEST
Input
OVERTEMP and OVERTEMP outputs are asserted and
VTEMP = VTRIP, Temperature Trip Voltage.
This pin may be left open if not used.
Over Temperature Switch output
Active High, Push-Pull
Digital
5
OVERTEMP
Asserted when the measured temperature exceeds the Trip Point
Output
Temperature or if TRIP TEST = 1
This pin may be left open if not used.
Over Temperature Switch output
Active Low, Open-drain (See Determining the Pull-up Resistor Value)
Digital
3
OVERTEMP
Asserted when the measured temperature exceeds the Trip Point
Output
Temperature or if TRIP TEST = 1
This pin may be left open if not used.
VTEMP Analog Voltage Output
If TRIP TEST = 0 then
Analog
VTEMP = VTS, Temperature Sensor Output Voltage
6
VTEMP
Output
If TRIP TEST = 1 then
VTEMP = VTRIP, Temperature Trip Voltage
This pin may be left open if not used.
4
VDD
Power
Positive Supply Voltage
2
GND
Ground
Power Supply Ground
The best thermal conductivity between the device and the PCB is achieved
by soldering the DAP of the package to the thermal pad on the PCB. The
DAP
Die Attach Pad
thermal pad can be a floating node. However, for improved noise immunity
the thermal pad should be connected to the circuit GND node, preferably
directly to pin 2 (GND) of the device.
Copyright © 2007–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM26LV



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