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VNH3SP30 数据表(PDF) 20 Page - STMicroelectronics |
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VNH3SP30 数据表(HTML) 20 Page - STMicroelectronics |
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20 / 26 page ![]() 20/26 VNH3SP30 MultiPowerSO-30 PC Board CHIPSET CONFIGURATION Auto and mutual Rthj-amb Vs PCB copper area in open box free air condition (according to page 20 definitions) MultiPowerSO-30 THERMAL DATA Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35 µm, Copper areas: from minimum pad lay-out to 16cm2). HIGH SIDE CHIP HSAB LOW SIDE CHIP A LOW SIDE CHIP B LSA LSB 0 5 10 15 20 25 30 35 40 45 0 5 10 15 20 cm 2 of Cu Area (refer to PCB layout) °C/W RthA RthB = RthC RthAB = RthAC RthBC |
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